Conductive Compounds

EP-1100
Silver Filled Electrically Conductive
Single Component Epoxy Adhesive

EP-1100 is a unique, one part electrically conductive epoxy adhesive used for surface mount component attachment, termination and other applications in hybrid circuits, membrane switches and other electromechanical assemblies. The rheology of EP-1100 makes it an ideal material for screen or stencil printing. EP-1100 exhibits excellent adhesion to most metal and plastic substrates and has excellent temperature resistance and toughness. EP-1100 is available in pre-weighed and sealed plastic pouches, open containers or plastic syringes. For dot dispense processes, EP-600 two component or EP-1000 single component adhesives are recommended.

TYPICAL PROPERTIES VALUES

Appearance: Thixotropic Silver Coloured Paste
Viscosity (Room Temperature): 75,000 to 100,000 cps
Shelf Life (Ambient Temperature): 30 days in unopened container
Hegman Gage: <100 µ
Volume Resistivity (ref ASTM D-257): <5.0 x 10 -4 ohm-cm
Coefficient of Thermal Expansion
Below Tg: 6.0 x 10 -5 in/in/°C
Above Tg: 1.5 x 10 -4 in/in/°C
Thermal Conductivity: 11 BTU in/ft² hr °F

Glass Transition Temperature (TMA): 110°C (Fully Cured)

Operating Temperature Range: -55°C to +175°C Continuous. Intermittent at higher temperatures when fully cured

Curing Schedule (Time at Temperature)/ 90% Cure/ Complete Cure
120°C/ 5 minutes/ 15 minutes
140°C/ 3 minutes/ 5 to 7 minutes

At 90% cure, the assembly can generally be handled carefully without the danger of damaging the adhesive bond. EP-1100 will not continue to cure at room temperature once heat is removed. Cure times above are intended as guidelines and are dependent on the actual glue line being held at the given temperature.

APPLICATION GUIDELINES

For screening, a monofilament polyester (157 to 200 mesh) or a stainless steel (165 to 270 mesh) screen is recommended with emulsion thickness between .001" and .003". A polyurethane squeegee with a Shore 'A' durometer between 60 and 70 is recommended. Stencil thicknesses of .001" to .003" are recommended, with a stainless steel squeegee.

In general, a more open screen with thicker emulsions, or a thicker stencil will give a larger pad of adhesive for bonding devices. However, thinner emulsions and stencils provide thinner pads that are less susceptible to wicking and shorting out during high temperature curing - especially with smaller surface mounted devices. EP-1100 can be thinned with solvent. Contact us for samples of non-toxic flammable solvent appropriate for thinning.

Because EP-1100 has a shelf life of 30 days at room temperature, the rheological properties allow for accurate and repeatable pad geometrics over long production runs. While the viscosity of the mixed material will change gradually over the 30 day storage window, most application equipment can easily compensate for the rheological changes to accurately maintain pad configuration.

As EP-1100 is used in a stencil printing or screen printing process, the energy from the constant movement of the flood bar and squeegee will cause the material to thicken more quickly. Production runs of between 12 and 24 hours are possible with stable material rheology dependant on ambient temperature, humidity and process parameters.

PACKAGING

EP-1100 is available in pre-weighed open containers, plastic pouches and EFD type syringes. There is no minimum purchase quantity with the open container packaging option. Contact us for more information about plastic pouch or EFD type syringe packaging configurations.

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The above guidelines are intended to provide a starting point for evaluation. Conductive Compounds Inc recognises that each customer's manufacturing process is unique and so can customise the rheology and curing properties of EP-1100 to conform more closely to your process parameters. Call us to discuss your application in more detail.

NOTE: Although the above properties are accurate to the best of our knowledge Conductive Compounds Inc makes no guarantees for customer specifications established in applications where this product is used. Customer assumes responsibility for determining fitness of use in their particular application.