Conductive Compounds

ESB150 is a two component, 100% solids thermally conductive adhesive designed for use in surface mount applications which require high temperature and humidity resistance and thermal shock resistance. ESB150 bonds well to ceramic, metal and plastic surfaces, and provides an excellent buffer to bonded substrates with different coefficients of thermal expansion. Other advantages of ESB150 include a low temperature curing cycle and good solvent resistance.

TYPICAL PROPERTIES Component A Component B
Appearance Thick White Paste Clear, Brown Colored Liquid
Mix Ratio (by weight) 100 Parts 12.5 Parts

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Viscosity After Mixing
(#7 Spindle, 10 rpm) 20,000 cps
Cure Schedule 80°F For 3 Hours* -or-
125°C for 30 Minutes
Pot Life (25°C) <1 Hour

*After 2 hours at 80°C, material has cured significantly and can be handled. Cure will continue at room temperature.

PHYSICAL PROPERTIES AFTER CURE Thermal Conductivity 0.7 to 0.9 W/m-°K
Volume Resistivity 1 x 1014-cm
Breakdown Voltage (14 mil film) >50 VAC/mil

Passes Exposure To 250°F. Steam For 192 Hours (.005" Bond Line, Al2O3 Substrates)

Passes 200 Cycles Thermal Shock (Al2O3 Substrates Bonded In A “Flip Chip” Configuration And Cycled From Liquid Nitrogen Directly Into 250°F Fluid And Directly Back)

For optimal thermal transfer properties, potting compounds should be deaerated under vacuum after mixing to remove entrapped air.

NOTE: Although the above typical properties are accurate to the best of our knowledge, Conductive Compounds, Inc. makes no guarantees for customer specifications established in applications where this product is used. Customer assumes responsibility for determining fitness of use in their particular application.