Conductive Compounds

No silicone contamination
Low temperature cure cycle
Easy removal for component repair or replacement
Long pot life after mixing
Easy 4:1 mix ratio, by weight
High temperature resistance
Excellent solvent resistance
TYPICAL PROPERTIES Component A Component B
Appearance Thick White Paste Clear, Brown Colored Liquid
Mix Ratio (by weight) 4 Parts 1 Part

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Viscosity After Mixing
(#7 Spindle, 10 rpm) 20,000 cps
Cure Schedule 80°F For 3 Hours* -or-
125°C for 90 Minutes
Gel Time (80°C, 30 gm scale) 65 Minutes
(25°C, 30 gm scale) >20 Hours
Pot Life (25°C) >6 Hours

*After 2 hours at 80°C, material has cured significantly and can be handled. Cure will continue at room temperature. When material is heated, top surface will be slightly tacky until material has time to cool to ambient temperature.

PHYSICAL PROPERTIES AFTER CURE Flammability Passes UL94-V0
Shore 'A' Hardness 50
Tensile Strength 200 psi
% Elongation At Break 120%
Thermal Conductivity 0.9 to 1.1 x 10-3cal/cm-sec-°C
Volume Resistivity 1 x 1011-cm
Breakdown Voltage (14 mil film) 350 VAC/mil

For optimal thermal transfer properties, potting compounds should be deaerated under vacuum after mixing to remove entrapped air.

NOTE: Although the above typical properties are accurate to the best of our knowledge, Conductive Compounds, Inc. makes no guarantees for customer specifications established in applications where this product is used. Customer assumes responsibility for determining fitness of use in their particular application.