Conductive Compounds

XM-409 is a single component, 100% solids thermally conductive adhesive designed for use in surface mount applications which require high temperature and humidity resistance and thermal shock resistance. XM-409 bonds well to ceramic, metal and plastic surfaces, and provides an excellent buffer to bonded substrates with different coefficients of thermal expansion. Other advantages of XM-409 include a low temperature curing cycle and long ambient shelf life. XM-409 should not be thinned with solvent.

TYPICAL PROPERTIES Appearance Thick Black Paste
Viscosity After Mixing (#7 Spindle, 10 rpm) 16,0000 cps
Cure Schedule 135°F For 30 Minutes
Shelf Life (25°C In Sealed Container) 1 Month
Gel Time (25 Gram Mass At 135°C <7 Minutes
Density 1.3 to 1.4

PHYSICAL PROPERTIES AFTER CURE Volume Resistivity 1 x 1014-cm
Breakdown Voltage >50 VAC/mil
Shore 'D' Durometer 80

For optimal thermal transfer properties, adhesive should be deaerated under vacuum to remove entrapped air.

NOTE: Although the above typical properties are accurate to the best of our knowledge, Conductive Compounds, Inc. makes no guarantees for customer specifications established in applications where this product is used. Customer assumes responsibility for determining fitness of use in their particular application.