2.0mm Pitch Connectors
.020" SQUARE PIN, SADDLE MOUNT, DOUBLE ROW STRAIGHT
SMD HEADER
Package Outline Drawing

Characteristics
Part Number |
PCB
Thickness |
Overall
"A" |
Above
"B" |
Below
"C" |
Gold on G2 "D" |
Plating
Option
YY |
Number
of
Positions
XX |
mm |
Inch |
mm |
Inch |
mm |
Inch |
mm |
Inch |
mm |
Inch |
NHTSM2331-XXYY |
.83 |
.032 |
8.00 |
.315 |
3.56 |
.140 |
2.93 |
.115 |
3.56 |
.140 |
T; G2 |
4-80 |
NHTSM2331-XXYY |
1.19 |
.047 |
8.00 |
.315 |
3.56 |
.140 |
2.93 |
.115 |
3.56 |
.140 |
T; G2 |
4-80 |
NHTSM2331-XXYY |
.83 |
.032 |
8.43 |
.332 |
4.00 |
.140 |
2.93 |
.115 |
3.56 |
.140 |
T; G2 |
4-80 |
NHTSM2331-XXYY |
1.19 |
.047 |
8.43 |
.332 |
4.00 |
.140 |
2.93 |
.115 |
3.56 |
.140 |
T; G2 |
4-80 |
Technical Characteristics |
Contact Material |
Phosphor Bronze, 0.20" sq, drawn wire, burr free
both ends |
Insulation Material |
Glass Filled Nylon 46, UL94V-O rated black |
Heat Deflection |
260° @ 264 PSI per ASTM D648 |
Insulation Resistance |
5,000 Meg Ohm @ 500VDC |
Current Rating |
2 amp continuous @ 100VDC/contact
|
Max Processing Temp |
250°C for 60 seconds |
Plating |
T = Tin 150µ" (3.8µ) bright tin over
50µ" (1.3µ) Ni |
G2 = Tin/Gold - 10µ" (.25µ) gold
over 50µ" (1.3µ) Ni at
mating end - balance of pin 150µ" (3.8µ) bright tin
over
50µ" (1.3µ) Ni |

|