Industry Pack Module Connector
IP MEZZANINE MALE SMD FOR IP MODULEWith locating Pins used on Carrier Board
Package Outline Drawing
Dimensions: Inche's
Mates with either our N8065 or N8066 series.
Characteristics
| Product Selection Table | ||||||||||
| Part Number |
"A"
|
"B"
|
"C"
|
"D"
|
Plating
Options YY |
Number
of Positions XX |
||||
|
mm
|
Inch
|
mm
|
Inch
|
mm
|
Inch
|
mm
|
Inch
|
|||
| N8062-XXYY |
34.85
|
1.372
|
40.39
|
1.59
|
44.45
|
1.75
|
30.48
|
1.20
|
G2
|
50
|
| Technical Characteristics | |
| Contact Material | Pin: Phosphor Bronze, .016" x .024" burr free |
| Insulation Material | Glass Filled Nylon 46, UL94V-O rated black |
| Heat Deflection | 260°C @ 264 PSI per ASTM D648 |
| Insulation Resistance | 5,000 Meg Ohm @ 500VDC |
| Current Rating | 1 amp continuous @ 100VDC/contact |
| Max Processing Temp | 250°C for 60 seconds |
| Plating | G2 = Tin/Gold - 10µ" (.25µ)
gold over 50µ" (1.3µ) Ni at mating end - balance of pin 150µ" (3.8µ) bright tin over 50µ" (1.3µ) Ni |
